Competence with Advanced System-on-Package Concept

COMPACT

The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.

Funders

Project information

Project duration

-

Funded by

European Structural and Investment Funds - INTERREG

Project funder

Regional Council of Lapland

Funding amount

620 000 EUR

Project coordinator

Other university or unit

Contact information

Contact person

Project description

Goal:

The goal of the project is to develop an advanced electronic packaging methodology based on Sequential Build Up (SBU) of Printed Circuit Board (PCB) using metallization process based on grafting with the managed reliability.

Implementation:

Design and development of interconnects using SBU technology based on Covalent Bonding Metallization (CBM)

Reliability analysis of developed structures

Standardization of the process for commercial use

Partners

  • Microelectronics Research Unit, University of Oulu
  • Luleå Tekniska Universitet
  • Detection Technology
  • Electrotech
  • Optronic

Research groups

  • Microelectronics Research Unit