Quality assessment and reliability of additively manufactured hybrid structural electronics

This thesis investigated the feasibility of hybrid and structural electronics as well as the applicability of simulation-assisted structural analysis as a technology development tool. Additionally, it analyzed the process throughput yield, product quality, and reliability. The topic is approached by studying the hybrid structural electronic samples and the influence of fabrication, and operational conditions on their performance.

During the study, four different sample types and two simulation models were utilized. The feasibility of hybrid structural electronics was analyzed using simulation environment and non-destructive optical and electrical characterization. To evaluate the reliability in cyclic rotational bending, an in-house build testing system was used. As the results of the analyses, failure mechanisms typical for the structure were identified. Additionally, prominent parameters that can improve the hybrid electronics structures and influence the reliability of the final product positively were identified.

The study proved the concept of hybrid and structural electronics enabling new properties for electronics and a simulation-assisted, non-destructive structural analysis being a suitable characterization method for this technology. According to the results, the process throughput yield, product quality and reliability can be enhanced with the proper design choices and manufacturing parameters.